{"product_id":"low-viscosity-high-hardness-epoxy-ab-resin-for-electronic-pcb-module-encapsulation","title":"Low Viscosity High Hardness Epoxy AB Resin for Electronic PCB Module Encapsulation","description":"\u003ch1\u003eYH-2180A\/B Black Epoxy Electronic Potting Compound\u003c\/h1\u003e\n\u003cp\u003eYH-2180A\/B is a two-component black epoxy resin potting system, specially developed for electronic encapsulation and circuit module protection. This epoxy AB compound features low viscosity, excellent fluidity, self-leveling property and great bubble release performance. After fully cured, it forms a high-hardness, smooth and polishable black surface.\u003c\/p\u003e\n\u003cp\u003eOur epoxy potting compound can flow into tiny gaps inside electronic assemblies, offering reliable insulation, waterproof, dustproof and shockproof protection for circuit boards. It effectively shields PCB, power modules, sensor modules and display modules from moisture, vibration and temperature changes, extending the service life of electronic products.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/2180_1.jpg?v=1789036127\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cp\u003e✅ Two-component epoxy A\/B system, easy mixing according to TDS ratio\u003cbr\u003e✅ Low viscosity, excellent flowability for filling narrow gaps\u003cbr\u003e✅ Great self-leveling \u0026amp; good deaeration, less bubbles after pouring\u003cbr\u003e✅ High hardness after curing, smooth black finish and polishable surface\u003cbr\u003e✅ Excellent electrical insulation \u0026amp; sealing performance\u003cbr\u003e✅ Stable physical property for long-term electronic protection\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/2180_2.jpg?v=1789036128\" alt=\"\"\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/2180_5.jpg?v=1789036127\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch3\u003eMain Applications\u003c\/h3\u003e\n\u003cp\u003eIdeal for potting and encapsulation of electronic assemblies: • PCB Assembly • Power Module • Sensor Module • Display Module • Electronic Control Module • Circuit board electronic modules\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/2180_6.jpg?v=1789036128\" alt=\"\"\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/2180_7.jpg?v=1789036128\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch3\u003eOperation Guide\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eWeigh Part A and Part B accurately strictly following the mixing ratio in TDS.\u003c\/li\u003e\n\u003cli\u003eStir Part A and Part B thoroughly until fully uniform.\u003c\/li\u003e\n\u003cli\u003ePour the mixed epoxy compound evenly into your electronic housing.\u003c\/li\u003e\n\u003cli\u003eCure under specified temperature \u0026amp; time as stated in the technical data sheet.\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/2180_8.jpg?v=1789036127\" alt=\"\"\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/2180_9.jpg?v=1789036128\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch3\u003eSafety, Packaging \u0026amp; Storage\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eWear protective gloves and goggles during mixing and potting operation.\u003c\/li\u003e\n\u003cli\u003eKeep product containers tightly sealed after use.\u003c\/li\u003e\n\u003cli\u003eStore the resin in a cool and dry environment.\u003c\/li\u003e\n\u003cli\u003eSee the full TDS document for complete packaging details and technical parameters.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/2180_10.jpg?v=1789036127\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch3\u003eOur Service\u003c\/h3\u003e\n\u003cp\u003eWe support custom formula adjustment for different electronic potting requirements. Wholesale bulk supply available for global distributors and electronic manufacturers. Contact us to get TDS, sample and competitive factory price.\u003c\/p\u003e","brand":"SOFAY","offers":[{"title":"Default Title","offer_id":49833005842660,"sku":null,"price":4.8,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/21802componentepoxyadhesive.jpg?v=1789036028","url":"https:\/\/sofaytech.com\/products\/low-viscosity-high-hardness-epoxy-ab-resin-for-electronic-pcb-module-encapsulation","provider":"SOFAY","version":"1.0","type":"link"}