{"product_id":"yh-9008a-b-ul94-v-0-flame-retardant-epoxy-potting-compound-two-part-low-viscosity-epoxy-resin-for-electronics-encapsulation","title":"YH-9008A\/B UL94 V-0 Flame Retardant Epoxy Potting Compound, Two Part Low Viscosity Epoxy Resin for Electronics Encapsulation","description":"\u003ch2\u003eYH-9008A\/B Flame-Retardant Epoxy Potting Compound\u003c\/h2\u003e\n\u003cp\u003eYH-9008A\/B is a two-component black epoxy AB potting compound formulated for electronic encapsulation and protection. Featuring UL94 V-0 flame retardant property, low viscosity and excellent fluidity, this epoxy system can be cured at room temperature or medium heating condition. After full curing, it delivers high hardness, great insulation, moisture resistance, smooth glossy and bubble-free surface, protecting electronic components from high\/low temperature shock, dust, moisture and electric breakdown.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/9008_1.jpg?v=1789188109\" alt=\"\"\u003e\u003c\/p\u003e\n\u003cp\u003eKey Benefits of YH-9008A\/B Epoxy Potting Compound\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e✅ UL94 V-0 flame retardant grade, meets strict electronics fire safety requirement\u003cbr\u003e- ✅ Low viscosity \u0026amp; good fluidity, easy to pour and fully fill tiny gaps inside PCB assemblies\u003cbr\u003e- ✅ High glass transition temperature TG ≥65°C\u003cbr\u003e- ✅ High Shore-D hardness 70±5, outstanding mechanical strength\u003cbr\u003e- ✅ Excellent insulation \u0026amp; moisture-proof performance\u003cbr\u003e- ✅ Wide operating temperature range: -40℃ ~ +130℃\u003cbr\u003e- ✅ Bubble-free casting, smooth and glossy cured surface\u003cbr\u003e- ✅ Dual curing option: room temperature cure or accelerated medium-temperature cure\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/9008_2.jpg?v=1789188108\" alt=\"\"\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/9008_5.jpg?v=1789188108\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch3\u003eTypical Applications\u003c\/h3\u003e\n\u003cp\u003eYH-9008A\/B two part epoxy potting resin is widely used for potting \u0026amp; encapsulation of below electronic parts:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eTransformers, power modules\u003c\/li\u003e\n\u003cli\u003eProximity sensors \u0026amp; industrial sensors\u003c\/li\u003e\n\u003cli\u003eBuzzers, atomizers, water pumps\u003c\/li\u003e\n\u003cli\u003eNegative ion generators and various PCB control boards It effectively isolates circuit boards from moisture, vibration, dust and extreme temperature environment, extending service life of electronics.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/9008_6.jpg?v=1789188109\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003ePart Properties (25℃)\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003ePart A: Black liquid, Density:1.70~1.80 g\/cm³, Viscosity:8000~14000 mPa·s\u003c\/li\u003e\n\u003cli\u003ePart B: Brown liquid, Density:1.08~1.15 g\/cm³, Viscosity:100~300 mPa·s\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eMixing Parameter\u003c\/strong\u003e Mixing Ratio (A:B) = 5:1 by weight Mixed viscosity(25℃):1500~2500 mPa·s Working time (200g @25℃): 20~30 mins Curing profile: Room temperature: 2~3h initial set, fully cured in 24h Medium temp 50~60℃: fully cured within 3~4 hours\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eCured Physical Properties\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eHardness: Shore-D 70±5\u003c\/li\u003e\n\u003cli\u003eVolume Resistivity \u0026gt;1.1×10¹⁵ Ω·cm\u003c\/li\u003e\n\u003cli\u003eSurface Resistivity \u0026gt;1.2×10¹⁴ Ω\u003c\/li\u003e\n\u003cli\u003eDielectric strength \u0026gt;18 kV\/mm\u003c\/li\u003e\n\u003cli\u003eTensile strength:35~50 MPa\u003c\/li\u003e\n\u003cli\u003eFlexural strength:60~80 MPa\u003c\/li\u003e\n\u003cli\u003eTG ≥65℃\u003c\/li\u003e\n\u003cli\u003eWorking temperature: -40℃ ~ +130℃\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cblockquote\u003e\n\u003cp\u003eNotes: All test data obtained after 24h room-temperature curing, for reference only.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/9008_3.jpg?v=1789188108\" alt=\"\"\u003e\u003c\/p\u003e\n\u003c\/blockquote\u003e\n\u003ch3\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/9008_7.jpg?v=1789188110\" alt=\"\"\u003e\u003c\/h3\u003e\n\u003ch3\u003eOperation Guide\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eStir Part A thoroughly before use, as fillers will settle during storage.\u003c\/li\u003e\n\u003cli\u003eWeigh Part A and Part B strictly by weight at ratio 5:1, stir fully, scrape the container wall and bottom during mixing.\u003c\/li\u003e\n\u003cli\u003ePour mixed epoxy compound into your electronics enclosure quickly. The resin flows naturally and fills small gaps. Second potting is allowed if required.\u003c\/li\u003e\n\u003cli\u003eFollow curing schedule: RT cure or heat cure for faster production.\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/9008_8.jpg?v=1789188108\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch3\u003ePackaging \u0026amp; Storage\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003ePackage: Part A: 25kg \/ 5kg per pail; Part B:5kg per pail. Custom packaging available.\u003c\/li\u003e\n\u003cli\u003eStorage: Keep sealed in cool and ventilated place, recommended storage temperature 25℃.\u003c\/li\u003e\n\u003cli\u003eShelf life: 6 months from production date under proper storage.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eSafety Notes\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eStore product in sealed, dry location.\u003c\/li\u003e\n\u003cli\u003eRun small batch test before mass production.\u003c\/li\u003e\n\u003cli\u003eKeep away from moisture.\u003c\/li\u003e\n\u003cli\u003eOperate in well-ventilated area.\u003c\/li\u003e\n\u003cli\u003eAvoid contact with eyes and skin. In case of eye contact, rinse immediately and seek medical treatment.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/9008_10.jpg?v=1789188109\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch3\u003eOur Service\u003c\/h3\u003e\n\u003cp\u003eWe supply standard YH-9008A\u0026amp;B epoxy potting compound, and we also support customized formula adjustment for viscosity, hardness and thermal performance based on your project requirement. Free lab samples can be arranged for your performance testing.\u003c\/p\u003e\n\u003cp\u003eWhatsApp: +86 18924550481\u003c\/p\u003e","brand":"SOFAY","offers":[{"title":"Default Title","offer_id":49844030210276,"sku":null,"price":5.5,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0779\/2368\/0484\/files\/90082componentepoxyadhesive.jpg?v=1789187971","url":"https:\/\/sofaytech.com\/products\/yh-9008a-b-ul94-v-0-flame-retardant-epoxy-potting-compound-two-part-low-viscosity-epoxy-resin-for-electronics-encapsulation","provider":"SOFAY","version":"1.0","type":"link"}