Low Stress Flexible Repairable Electronic Potting AB Glue For PCB, LED Driver, Automotive Module

YH-6010A/B Polyurethane Potting Compound

YH-6010A/B is a two-component polyurethane potting compound with mixing ratio 5:1 by weight. It is solvent-free, low-stress, flexible and repairable after full curing.

With thermal conductivity of 0.4~0.5 W/m·K, outstanding electrical insulation and waterproof & moisture-proof performance, this potting glue can fully protect electronic components under harsh environments from -50℃ to +120℃. No bubbles during pouring, good fluidity to fill tiny gaps of PCB boards.

 Key Features

✅ Low stress & flexible cured material, avoid cracking during temperature cycling
✅ Excellent electrical insulation property
✅ Thermal conductivity: 0.4~0.5 W/m·K
✅ Low viscosity, great fluidity, bubble-free casting
✅ Waterproof, moisture-proof and dust-proof protection
✅ Repairable formula for electronics maintenance
✅ RoHS compliant, environment friendly, solvent-free
✅ Wide operating temperature: -50℃ ~ +120℃

Wide Applications

• LED Drivers & LED lighting modules
• Power supply & small transformers
• PCB circuit boards
• Automotive electronic control modules
• Sensors and electronic components
• High-end electronic modules

Technical Specifications

Mixing Ratio: A : B = 5 : 1 (by weight)

• Part A: Grey viscous liquid
• Part B: Brown transparent liquid
• Mixed viscosity (25℃): 2000±500 cps
• Working time: 60±10 minutes
• Curing schedule: 25℃ room temperature: fully cured in 24h 60℃: 60–90 min | 80℃:45–65 min

Cured Properties

• Hardness: Shore A 85±5
• Thermal conductivity: 0.4~0.5 W/m·K
• Continuous working temperature: -50 ~ +120℃
• Breakdown voltage: >16 kV/mm
• Low water absorption & stable dielectric performance
• Shelf life: 6 months when sealed and stored in cool & ventilated place at 25℃

Operation Guide

1. Weigh Part A and Part B strictly at 5:1 by weight. Stir thoroughly, scrape glue on container wall and bottom to get homogeneous mixture.
2. Stir Part A evenly before use.
3. Pour mixed compound into your electronic housing promptly, the glue flows automatically and fills gaps. Second pouring is available if required.
4. Cure at room temperature or by heating to shorten curing cycle.

Packaging & Storage

• Package: Part A 25kg per pail, Part B 5kg per jug. Custom packaging available.
• Storage: Keep sealed in cool, dry and ventilated area at 25℃. Part B is moisture sensitive, please re-seal immediately after opening.

Safety Notes

Wear protective gloves and safety goggles during operation. Work in well-ventilated environment. Rinse eyes with plenty of clean water and seek medical help once contact occurs. Clean skin with soap and water after touching the material. We recommend small batch test before mass production.

We provide free samples and custom formulation service for your project. WhatsApp: +86 18924550481