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Low Viscosity High Hardness Epoxy AB Resin for Electronic PCB Module Encapsulation
Low Viscosity High Hardness Epoxy AB Resin for Electronic PCB Module Encapsulation
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YH-2180A/B Black Epoxy Electronic Potting Compound
YH-2180A/B is a two-component black epoxy resin potting system, specially developed for electronic encapsulation and circuit module protection. This epoxy AB compound features low viscosity, excellent fluidity, self-leveling property and great bubble release performance. After fully cured, it forms a high-hardness, smooth and polishable black surface.
Our epoxy potting compound can flow into tiny gaps inside electronic assemblies, offering reliable insulation, waterproof, dustproof and shockproof protection for circuit boards. It effectively shields PCB, power modules, sensor modules and display modules from moisture, vibration and temperature changes, extending the service life of electronic products.

Key Features
✅ Two-component epoxy A/B system, easy mixing according to TDS ratio
✅ Low viscosity, excellent flowability for filling narrow gaps
✅ Great self-leveling & good deaeration, less bubbles after pouring
✅ High hardness after curing, smooth black finish and polishable surface
✅ Excellent electrical insulation & sealing performance
✅ Stable physical property for long-term electronic protection


Main Applications
Ideal for potting and encapsulation of electronic assemblies: • PCB Assembly • Power Module • Sensor Module • Display Module • Electronic Control Module • Circuit board electronic modules


Operation Guide
- Weigh Part A and Part B accurately strictly following the mixing ratio in TDS.
- Stir Part A and Part B thoroughly until fully uniform.
- Pour the mixed epoxy compound evenly into your electronic housing.
- Cure under specified temperature & time as stated in the technical data sheet.


Safety, Packaging & Storage
- Wear protective gloves and goggles during mixing and potting operation.
- Keep product containers tightly sealed after use.
- Store the resin in a cool and dry environment.
- See the full TDS document for complete packaging details and technical parameters.

Our Service
We support custom formula adjustment for different electronic potting requirements. Wholesale bulk supply available for global distributors and electronic manufacturers. Contact us to get TDS, sample and competitive factory price.
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