Product Overview

S-913A/B is a two-component room-temperature curing epoxy AB potting compound. After mixing component A resin and component B hardener at the specified weight ratio, it cures into a rigid solid with low shrinkage, excellent thermal conductivity and superior electrical insulation performance.

This epoxy potting resin is designed to encapsulate and protect electronic circuit boards, power supplies, automotive control modules and power electronics components. The cured epoxy material effectively isolates moisture, dust and mechanical vibration, delivering long-term reliable protection for electronics across a wide working temperature range.

Custom formulation is available to adjust hardness, viscosity, curing speed and thermal conductivity according to your project requirements. Free samples can be provided for performance validation.

Why Choose S-913A/B

1. LOW SHRINKAGE Minimal volume shrinkage after curing for reliable encapsulation
2. WIDE TEMPERATURE RESISTANCE Stable performance over a broad temperature range
3. ELECTRICAL INSULATION High dielectric strength to protect electronic circuits
4. WATER & MOISTURE RESISTANT Prevent water vapor and moisture penetration
5. NON-CORROSIVE Will not corrode metal, copper and PCB substrates
6. HIGH THERMAL CONDUCTIVITY Efficient heat dissipation for power electronics

Typical Applications

S-913A/B epoxy potting adhesive is widely used for encapsulation and protection of:
✅ Switch-mode power supplies
✅ LED driver power units
✅ Automotive electronic control modules
✅ Household appliance controllers
✅ Power electronics circuit boards
✅ Sensors, transformers and automotive ignition modules

NOTES & PACKAGING

• STORE SEALED: Use promptly once A & B are mixed
• STIR BEFORE USE: Fillers may settle during storage
• INDUSTRIAL CHEMICAL PRODUCT: Wear gloves & goggles during operation, avoid skin/eye contact

PACKAGING A: 25 KG or 5 KG per pail B: 5 KG per pail Custom packaging available

STORAGE Keep sealed · Shelf life: 6 months · Store in cool dry place

OPERATION GUIDE

WEIGHING & MIXING A:B = 10:1 by weight Mix thoroughly, keep mixing ratio error within 3%

MIXING CONTAINER Stir both components fully Use after uniform mixing

POTTING & CURING

POUR INTO THE DEVICE Vacuum de-aeration recommended to remove bubbles Heat cure: 40–50 mins Room temperature cure: 6–8 H Cure speed depends on ambient temperature

S-913A/B two-component epoxy AB potting resin with high thermal conductivity, low shrinkage and excellent electrical insulation. Ideal for PCB, power supply and automotive electronic module encapsulation. Custom formula & free samples available.