YH-9008A/B UL94 V-0 Flame Retardant Epoxy Potting Compound, Two Part Low Viscosity Epoxy Resin for Electronics Encapsulation

YH-9008A/B Flame-Retardant Epoxy Potting Compound

YH-9008A/B is a two-component black epoxy AB potting compound formulated for electronic encapsulation and protection. Featuring UL94 V-0 flame retardant property, low viscosity and excellent fluidity, this epoxy system can be cured at room temperature or medium heating condition. After full curing, it delivers high hardness, great insulation, moisture resistance, smooth glossy and bubble-free surface, protecting electronic components from high/low temperature shock, dust, moisture and electric breakdown.

Key Benefits of YH-9008A/B Epoxy Potting Compound

• ✅ UL94 V-0 flame retardant grade, meets strict electronics fire safety requirement
  - ✅ Low viscosity & good fluidity, easy to pour and fully fill tiny gaps inside PCB assemblies
  - ✅ High glass transition temperature TG ≥65°C
  - ✅ High Shore-D hardness 70±5, outstanding mechanical strength
  - ✅ Excellent insulation & moisture-proof performance
  - ✅ Wide operating temperature range: -40℃ ~ +130℃
  - ✅ Bubble-free casting, smooth and glossy cured surface
  - ✅ Dual curing option: room temperature cure or accelerated medium-temperature cure

Typical Applications

YH-9008A/B two part epoxy potting resin is widely used for potting & encapsulation of below electronic parts:

• Transformers, power modules
• Proximity sensors & industrial sensors
• Buzzers, atomizers, water pumps
• Negative ion generators and various PCB control boards It effectively isolates circuit boards from moisture, vibration, dust and extreme temperature environment, extending service life of electronics.

Technical Specifications

Part Properties (25℃)

• Part A: Black liquid, Density:1.70~1.80 g/cm³, Viscosity:8000~14000 mPa·s
• Part B: Brown liquid, Density:1.08~1.15 g/cm³, Viscosity:100~300 mPa·s

Mixing Parameter Mixing Ratio (A:B) = 5:1 by weight Mixed viscosity(25℃):1500~2500 mPa·s Working time (200g @25℃): 20~30 mins Curing profile: Room temperature: 2~3h initial set, fully cured in 24h Medium temp 50~60℃: fully cured within 3~4 hours

Cured Physical Properties

• Hardness: Shore-D 70±5
• Volume Resistivity >1.1×10¹⁵ Ω·cm
• Surface Resistivity >1.2×10¹⁴ Ω
• Dielectric strength >18 kV/mm
• Tensile strength:35~50 MPa
• Flexural strength:60~80 MPa
• TG ≥65℃
• Working temperature: -40℃ ~ +130℃

Notes: All test data obtained after 24h room-temperature curing, for reference only.

Operation Guide

1. Stir Part A thoroughly before use, as fillers will settle during storage.
2. Weigh Part A and Part B strictly by weight at ratio 5:1, stir fully, scrape the container wall and bottom during mixing.
3. Pour mixed epoxy compound into your electronics enclosure quickly. The resin flows naturally and fills small gaps. Second potting is allowed if required.
4. Follow curing schedule: RT cure or heat cure for faster production.

Packaging & Storage

• Package: Part A: 25kg / 5kg per pail; Part B:5kg per pail. Custom packaging available.
• Storage: Keep sealed in cool and ventilated place, recommended storage temperature 25℃.
• Shelf life: 6 months from production date under proper storage.

Safety Notes

• Store product in sealed, dry location.
• Run small batch test before mass production.
• Keep away from moisture.
• Operate in well-ventilated area.
• Avoid contact with eyes and skin. In case of eye contact, rinse immediately and seek medical treatment.

Our Service

We supply standard YH-9008A&B epoxy potting compound, and we also support customized formula adjustment for viscosity, hardness and thermal performance based on your project requirement. Free lab samples can be arranged for your performance testing.

WhatsApp: +86 18924550481