YH-925AB Thermally Conductive Silicone Potting Compound

Product Description

Overview

YH-925A/B is a two-component addition-cure thermally conductive silicone potting compound, mixed at a 1:1 weight ratio. It cures at room temperature or with heat acceleration, generating no reaction by-products during curing. The cured silicone remains flexible with low internal stress, featuring stable electrical insulation, excellent thermal conductivity ≥3.0 W/(m·K), and easy removal for circuit board maintenance and repair.

This AB silicone potting gel is designed for long-term encapsulation and protection of sensitive electronic components, effectively transferring heat from power modules to heat sinks while sealing PCBs against moisture, dust, vibration and thermal shock. It works reliably across a wide temperature range of -60℃ ~ +200℃.

Key Features

✅ High thermal conductivity ≥3.0 W/(m·K), excellent thermal management
✅ Low stress flexible silicone, no cracking during temperature cycling
✅ Stable electrical insulation performance
✅ Repairable & easy removal for PCB maintenance
✅ Room temperature curing or heat accelerated curing
✅ Addition cure system, no by-products generated
✅ Wide operating temperature: -60℃ ~ 200℃
✅ 1:1 weight mixing ratio, easy operation
✅ Long pot life: 60-90 minutes working time at 25℃

Typical Applications

• LED street light drivers & spotlight power modules
• Electroplating power supplies
• Power rectifiers
• Power transformers
• Inverter & converter control modules
• Automotive & industrial electronic control units
• Other power electronics requiring thermal dissipation and encapsulation protection

Technical Data Summary

Mix Ratio (By Weight): A:B = 1:1 Mixed Viscosity: 5000~7000 cps @25℃ Working Time (@25℃): 60–90 min Room Temp Cure: 3~4 hours initial cure, fully cured in 24 hours Heat Cure (60~80℃): 1–2 hours Shore A Hardness: 15–25 Thermal Conductivity: ≥3.0 W/(m·K) Dielectric Strength: ≥15 kV/mm Volume Resistivity: ≥1.2×10¹⁴ Ω·cm Elongation: ≥50% Tensile Strength: ≥1 MPa

Operation Guide

1. Stir Part A and Part B separately before use.
2. Weigh and mix Part A and Part B at 1:1 weight ratio, stir thoroughly until homogeneous.
3. Pour the mixture into electronic housing, perform vacuum deaeration for 1–3 min under pressure below -0.08 MPa.
4. Cure at room temperature, or accelerate curing under 60–80℃ heating.

Safety, Packaging & Storage

• Wear protective gloves and goggles during handling.
• Packaging: 50kg per set (25kg Part A drum + 25kg Part B drum). Custom package available.
• Storage: Keep container tightly sealed, store in dry & cool environment below 25℃.
• Shelf Life: 12 months in original sealed packaging.
• Transport: Non-hazardous goods for general chemical transport.
• Note: Vacuum potting equipment is required for automated encapsulation.