YH-991AB Transparent Silicone Potting Compound | Two Component 1:1 AB Silicone Encapsulant for PCB, LED Driver & Electronic Modules

H1: YH-991A/B Transparent Silicone Potting Compound

Two-Component · Mix Ratio A:B=1:1 · RoHS Compliant

YH-991A/B is a high-clarity two-part silicone potting compound designed for electronic encapsulation and protection. This 1:1 mix ratio AB silicone gel cures at room temperature or with heat acceleration, forming a flexible, low-stress transparent protective layer for sensitive electronic components.

Key Advantages

• High clarity & transparent after curing, easy for visual inspection of circuits
• Excellent electrical insulation performance
• Room temperature curing, simple operation with 1:1 weight mixing ratio
• Wide working temperature range: -60℃ ~ 200℃
• Low viscosity for easy pouring and bubble release
• Low stress & flexible cured material, no damage to delicate electronics
• Waterproof and moisture-proof, blocks dust, vapor and mild chemical corrosion

Technical Specifications

Part Properties

• Part A: Colorless oily liquid, Viscosity(25℃):850-1100 cps, Density:0.96-1.0 g/cm³
• Part B: Colorless transparent liquid, Viscosity(25℃):400-650 cps, Density:0.94-0.98 g/cm³

Mixing Parameters

• Mixing Ratio (By weight): A:B = 1:1
• Mixed Viscosity (25℃):450-600 cps
• Surface skin time(70g,25℃):90-120 min
• Working time(50g,25℃):50-60 min
• Curing Schedule: 24h @25℃ (room temp cure); 40±5 min @80℃ (heat cure)

Cured Properties

• Hardness: Shore A 17-22
• Dielectric strength: ≥15 kV/mm
• Volume resistivity: ≥1.0×10¹⁶ Ω·cm
• Linear shrinkage: 0.03%
• Shelf life: 6 months

Note: All typical data tested at 25℃, RH 55%. For buyer reference only.

Applications

YH-991A/B transparent silicone potting compound is widely used for sealing and encapsulation of:
✅ LED strip light & LED driver
✅ PCB circuit modules
✅ Electronic components
✅ Automotive & industrial sensors
✅ Display lamps
✅ Outdoor electronic control units

It provides gentle low-stress protection, perfectly protects electronics from extreme hot & cold environment, vibration, moisture and dust.

Operation Guide

1. Weighing & Mixing Accurately weigh Part A and Part B at 1:1 by weight. Stir thoroughly, scrape the container walls and bottom to achieve uniform mixture. Stir Part A evenly before use.

Part A: colorless oily liquid; Part B: colorless transparent liquid

2. Potting Pour mixed silicone compound into your electronic housing promptly. The low-viscosity material flows freely and fills all small gaps. Second potting is acceptable if needed.
3. Curing Room temperature (25℃): fully cure within 24 hours. Heat curing at 80℃: fully cure in 40±5 minutes.

Packaging & Storage

Packaging Options

• Standard set: A:20kg + B:20kg (40kg/set)
• Small set: A:5kg + B:5kg (10kg/set)
• Custom packaging available upon request

Storage Requirements Store sealed in a cool and dry environment at 25℃. Shelf life: 6 months. Classified as non-dangerous goods for shipment.

Safety Notes

• In case of eye contact: Rinse eyes with clean water and seek medical help immediately.
• In case of skin contact: Wash skin thoroughly with soap and running water.
• Run small batch test before mass production.
• Keep working area dry and clean.

Why Choose Us

We are a professional silicone & epoxy potting compound manufacturer. We provide free sample testing, full TDS/SDS documents, stable bulk supply and custom formulation service for global electronic manufacturers and distributors. Contact us for technical support and wholesale quotation.